MARC details
| 000 -LEADER |
|---|
| fixed length control field |
04322nam a22005175i 4500 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
TR-AnTOB |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20231121141227.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
|---|
| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
220528s2022 si | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9789811900839 |
| 024 7# - OTHER STANDARD IDENTIFIER |
|---|
| Standard number or code |
10.1007/978-981-19-0083-9 |
| Source of number or code |
doi |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
TR-AnTOB |
| Language of cataloging |
eng |
| Description conventions |
rda |
| Transcribing agency |
TR-AnTOB |
| 041 ## - LANGUAGE CODE |
|---|
| Language code of text/sound track or separate title |
İngilizce |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7874 |
| 072 #7 - SUBJECT CATEGORY CODE |
|---|
| Subject category code |
TJF |
| Source |
bicssc |
|
|---|
| Subject category code |
TEC008000 |
| Source |
bisacsh |
|
|---|
| Subject category code |
TJF |
| Source |
thema |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
|---|
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TK7874EBK |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
MicroSystem Based on SiP Technology |
| Medium |
[electronic resource] / |
| Statement of responsibility, etc. |
edited by Suny Li. |
| 250 ## - EDITION STATEMENT |
|---|
| Edition statement |
1st ed. 2022. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
Singapore : |
| Name of producer, publisher, distributor, manufacturer |
Springer Nature Singapore : |
| -- |
Imprint: Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2022. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
1 online resource |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
online resource |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
|---|
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
From Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronics. |
|
|---|
| Topical term or geographic name entry element |
Semiconductors. |
|
|---|
| Topical term or geographic name entry element |
Industrial engineering. |
|
|---|
| Topical term or geographic name entry element |
Production engineering. |
|
|---|
| Topical term or geographic name entry element |
Electronics and Microelectronics, Instrumentation. |
|
|---|
| Topical term or geographic name entry element |
Semiconductors. |
|
|---|
| Topical term or geographic name entry element |
Industrial and Production Engineering. |
| 653 #0 - INDEX TERM--UNCONTROLLED |
|---|
| Uncontrolled term |
Integrated circuits -- Design and construction |
|
|---|
| Uncontrolled term |
Multichip modules (Microelectronics) -- Design and construction |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Li, Suny. |
| Relator term |
editor. |
| Relator code |
edt |
| -- |
http://id.loc.gov/vocabulary/relators/edt |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
<a href="https://doi.org/10.1007/978-981-19-0083-9">https://doi.org/10.1007/978-981-19-0083-9</a> |
| Materials specified |
Springer eBooks |
| Public note |
Online access link to the resource |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
Library of Congress Classification |
| Koha item type |
E-Book |
