TY  - BOOK
AU  - Chakravarthy,V.V.S.S.S.
AU  - Flores-Fuentes,Wendy
AU  - Bhateja,Vikrant
AU  - Biswal,B.N.
ED  - SpringerLink (Online service)
TI  - Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1 
T2  - Lecture Notes in Electrical Engineering,
SN  - 9789811685507
AV  - TK7874 
PY  - 2022///
CY  - Singapore
PB  - Springer Nature Singapore, Imprint: Springer
KW  - Electronic circuits
KW  - Electronics
KW  - Embedded computer systems
KW  - Internet of things
KW  - Electronic Circuits and Systems
KW  - Electronics and Microelectronics, Instrumentation
KW  - Embedded Systems
KW  - Internet of Things
KW  - Electromagnetism -- Congresses
KW  - Internet of things -- Congresses
KW  - Microelectronics -- Congresses
N1  - Synthesis of KNN Algorithm in FPGA Technology -- Study of Architecture and Performance Analysis of Approximation Multipliers -- Design and Analysis of Energy Efficient Logic Gates Using INDEP Short Gate FinFETs at 10nm Technology Node -- SIMPLE-DRR: A New Energy-Efficient Multi-hop Routing Protocol in WBANs for Health Monitoring -- Design of Class AB and Class C Amplifier -- Lightgbm Model for Credit Card Fraud Discovery -- PV System Based Switched Capacitor Dc-Dc Converter for High Voltage Gain using fuzzy-PID Controller -- Startup Circuits for Zero Current Reduction in Bandgap Reference Circuit -- Recycle of Plastic Material for Fabrication of Paver Blocks -- Handwritten Cursive English Character Recognition using DAG-CNN
N2  - This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2021), held in Bhubaneswar, Odisha, India during 27 – 28 August 2021. The papers were written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society
UR  - https://doi.org/10.1007/978-981-16-8550-7
ER  -