000 04322nam a22005175i 4500
999 _c200457204
_d75416
003 TR-AnTOB
005 20231121141227.0
007 cr nn 008mamaa
008 220528s2022 si | s |||| 0|eng d
020 _a9789811900839
024 7 _a10.1007/978-981-19-0083-9
_2doi
040 _aTR-AnTOB
_beng
_erda
_cTR-AnTOB
041 _aeng
050 4 _aTK7874
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
072 7 _aTJF
_2thema
090 _aTK7874EBK
245 1 0 _aMicroSystem Based on SiP Technology
_h[electronic resource] /
_cedited by Suny Li.
250 _a1st ed. 2022.
264 1 _aSingapore :
_bSpringer Nature Singapore :
_bImprint: Springer,
_c2022.
300 _a1 online resource
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aFrom Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case.
520 _aThis book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
650 0 _aElectronics.
650 0 _aSemiconductors.
650 0 _aIndustrial engineering.
650 0 _aProduction engineering.
650 1 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aSemiconductors.
650 2 4 _aIndustrial and Production Engineering.
653 0 _aIntegrated circuits -- Design and construction
653 0 _aMultichip modules (Microelectronics) -- Design and construction
700 1 _aLi, Suny.
_eeditor.
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
710 2 _aSpringerLink (Online service)
856 4 0 _uhttps://doi.org/10.1007/978-981-19-0083-9
_3Springer eBooks
_zOnline access link to the resource
942 _2lcc
_cEBK