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020 _a9783030977269
024 7 _a10.1007/978-3-030-97726-9
_2doi
040 _aTR-AnTOB
_beng
_cTR-AnTOB
_erda
041 _aeng
050 4 _aTK7872.T55
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
072 7 _aTJF
_2thema
090 _aTK7872.T55EBK
100 1 _aElsobky, Mourad.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aUltra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil
_h[electronic resource] /
_cby Mourad Elsobky.
250 _a1st ed. 2022.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2022.
300 _a1 online resource
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringer Theses, Recognizing Outstanding Ph.D. Research,
_x2190-5061
505 0 _aMotivation -- Introduction to Hybrid System-in-Foil -- O-Chip/On-Foil Passive and Active Components.
520 _aThis book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.
650 0 _aElectronics.
650 0 _aElectronic circuits.
650 1 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aElectronic Circuits and Systems.
653 0 _aThin film devices
710 2 _aSpringerLink (Online service)
830 0 _aSpringer Theses, Recognizing Outstanding Ph.D. Research,
_x2190-5061
856 4 0 _uhttps://doi.org/10.1007/978-3-030-97726-9
_3Springer eBooks
_zOnline access link to the resource
942 _2lcc
_cEBK