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020 _a9789811698248
024 7 _a10.1007/978-981-16-9824-8
_2doi
040 _aTR-AnTOB
_beng
_erda
_cTR-AnTOB
041 _aeng
050 4 _aTK7870
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
090 _aTK7870EBK
100 1 _aKuttiyil Thomas, Oommen Tharakan.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aElectronics Production Defects and Analysis
_h[electronic resource] /
_cby Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan.
250 _a1st ed. 2022.
264 1 _aSingapore :
_bSpringer Nature Singapore :
_bImprint: Springer,
_c2022.
300 _a1 online resource
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringer Tracts in Electrical and Electronics Engineering,
_x2731-4219
505 0 _aChapter 1: Introduction -- Chapter 2: Soldering Defects -- Chapter 3: PCB Defects -- Chapter 4: Mounting Defects -- Chapter 5: Conformal Coating and Potting Defects -- Chapter 6: EEE Component Defects -- Chapter 7: Workmanship Defects -- Chapter 8: Defects due to the usage of Non-FFF Components -- Chapter 9: Defects in CAD Layout.
520 _aThis book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
650 0 _aElectronic circuits.
650 0 _aElectronics.
650 0 _aElectric power production.
650 0 _aIndustrial engineering.
650 0 _aProduction engineering.
650 1 4 _aElectronic Circuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aElectrical Power Engineering.
650 2 4 _aIndustrial and Production Engineering.
653 0 _aElectronic apparatus and appliances -- Defects
653 0 _aElectronic apparatus and appliances -- Design and construction
700 1 _aGopalan, Padma Padmanabhan.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
710 2 _aSpringerLink (Online service)
830 0 _aSpringer Tracts in Electrical and Electronics Engineering,
_x2731-4219
856 4 0 _uhttps://doi.org/10.1007/978-981-16-9824-8
_3Springer eBooks
_zOnline access link to the resource
942 _2lcc
_cEBK