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008 | 220408s2022 si | s |||| 0|eng d | ||
020 | _a9789811698248 | ||
024 | 7 |
_a10.1007/978-981-16-9824-8 _2doi |
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040 |
_aTR-AnTOB _beng _erda _cTR-AnTOB |
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041 | _aeng | ||
050 | 4 | _aTK7870 | |
072 | 7 |
_aTJFC _2bicssc |
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072 | 7 |
_aTEC008010 _2bisacsh |
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072 | 7 |
_aTJFC _2thema |
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090 | _aTK7870EBK | ||
100 | 1 |
_aKuttiyil Thomas, Oommen Tharakan. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut |
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245 | 1 | 0 |
_aElectronics Production Defects and Analysis _h[electronic resource] / _cby Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan. |
250 | _a1st ed. 2022. | ||
264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2022. |
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300 | _a1 online resource | ||
336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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490 | 1 |
_aSpringer Tracts in Electrical and Electronics Engineering, _x2731-4219 |
|
505 | 0 | _aChapter 1: Introduction -- Chapter 2: Soldering Defects -- Chapter 3: PCB Defects -- Chapter 4: Mounting Defects -- Chapter 5: Conformal Coating and Potting Defects -- Chapter 6: EEE Component Defects -- Chapter 7: Workmanship Defects -- Chapter 8: Defects due to the usage of Non-FFF Components -- Chapter 9: Defects in CAD Layout. | |
520 | _aThis book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students. | ||
650 | 0 | _aElectronic circuits. | |
650 | 0 | _aElectronics. | |
650 | 0 | _aElectric power production. | |
650 | 0 | _aIndustrial engineering. | |
650 | 0 | _aProduction engineering. | |
650 | 1 | 4 | _aElectronic Circuits and Systems. |
650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
650 | 2 | 4 | _aElectrical Power Engineering. |
650 | 2 | 4 | _aIndustrial and Production Engineering. |
653 | 0 | _aElectronic apparatus and appliances -- Defects | |
653 | 0 | _aElectronic apparatus and appliances -- Design and construction | |
700 | 1 |
_aGopalan, Padma Padmanabhan. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut |
|
710 | 2 | _aSpringerLink (Online service) | |
830 | 0 |
_aSpringer Tracts in Electrical and Electronics Engineering, _x2731-4219 |
|
856 | 4 | 0 |
_uhttps://doi.org/10.1007/978-981-16-9824-8 _3Springer eBooks _zOnline access link to the resource |
942 |
_2lcc _cEBK |