000 | 05270cam a2200601 i 4500 | ||
---|---|---|---|
001 | 911618352 | ||
003 | OCoLC | ||
005 | 20250131161253.0 | ||
006 | m o d | ||
007 | cr ||||||||||| | ||
008 | 150623s2015 nju o 001 0 eng | ||
015 |
_aGBB628725 _2bnb |
||
019 |
_a916922176 _a935676702 |
||
020 | _a9781119162322 (pdf) | ||
020 | _a1119162327 (pdf) | ||
020 | _a9781119162339 (epub) | ||
020 | _a1119162335 (epub) | ||
020 | _z9781119162193 (cloth) | ||
020 | _a9781119162346 | ||
020 | _a1119162343 | ||
020 | _a111916219X | ||
020 | _a9781119162193 | ||
035 |
_a(OCoLC)911618352 _z(OCoLC)916922176 _z(OCoLC)935676702 |
||
037 |
_a9781119162339 _bWiley |
||
040 |
_aDLC _beng _erda _cDLC _dN$T _dIDEBK _dDG1 _dEBLCP _dYDXCP _dCDX _dRECBK _dCOO _dOCLCF _dOCLCO _dOCLCQ _dNLE |
||
042 | _apcc | ||
050 | 0 | 0 | _aTA455.A34 |
072 | 7 |
_aTEC _x009000 _2bisacsh |
|
072 | 7 |
_aTEC _x035000 _2bisacsh |
|
245 | 0 | 0 |
_aProgress in adhesion and adhesives / _cedited by K.L. Mittal |
264 | 1 |
_aHoboken, New Jersey : _bJohn Wiley and Sons, Inc., _c[2015] |
|
300 | _a1 online resource | ||
336 |
_atext _btxt _2rdacontent |
||
337 |
_acomputer _bc _2rdamedia |
||
338 |
_aonline resource _bcr _2rdacarrier |
||
500 | _aIncludes index | ||
505 | 0 | _aCover; Title Page; Copyright Page; Contents; Preface; 1 Adhesion of Condensed Bodies at Microscale: Variation with Movable Boundary Conditions; 1.1 Introduction; 1.2 Kinematics: Energy Variation with Movable Boundary Conditions; 1.3 Microbeam/plate Adhesion; 1.4 Droplet Adhesion to a Solid; 1.5 Elastica Model of CNT Adhesion; 1.6 Cell Adhesion; 1.7 Summary and Prospects; Acknowledgements; References; 2 Imparting Adhesion Property to Silicone Materials: Challenges and Solutions; 2.1 Introduction; 2.2 Cured PDMS; 2.2.1 Curing Reactions; 2.2.1.1 Free-Radical Curing; 2.2.1.2 Condensation Curing | |
505 | 8 | _a2.2.1.3 Hydrosilylation (Addition) Curing2.2.2 Surface Properties; 2.2.3 Adhesion Property; 2.3 Methods for Cross-Linked PDMS Surface Modification; 2.3.1 Physical Techniques; 2.3.1.1 Plasma Treatment; 2.3.1.2 Corona Treatment; 2.3.1.3 UV/O3 Treatment; 2.3.1.4 Laser Treatment; 2.3.1.5 Physical Adsorption; 2.3.2 Wet Chemical Techniques; 2.3.2.1 LbL Deposition; 2.3.2.2 Sol-Gel Method; 2.3.2.3 Other Wet Chemical Treatments; 2.3.3 Combination of Physical and Chemical Techniques; 2.3.3.1 Covalent Surface Grafting; 2.3.3.2 Modification by Amphiphilic Block Copolymers | |
505 | 8 | _a2.3.3.3 Other Combination of Physical and Chemical Techniques2.4 Summary and Prospects; Acknowledgements; References; 3 Functionally Graded Adhesively Bonded Joints; 3.1 Introduction; 3.2 Functionally Graded Materials; 3.3 Constitutive Relations; 3.4 Joints with Functionally Graded Adherends; 3.5 Functionally Graded Adhesives; 3.6 Conclusions; References; 4 Synthetic Adhesives for Wood Panels: Chemistry and Technology; 4.1 Introduction; 4.2 Urea-formaldehyde (UF) Adhesives; 4.3 Melamine-formaldehyde (MF) and Melamine-ureaformaldehyde (MUF) Adhesives; 4.4 Phenolic Resins | |
505 | 8 | _a4.4.1 Reactivity and Hardening Reactions of PF Adhesive Resins4.4.2 Modification of Phenolic Resins; 4.4.2.1 Post-addition of Urea; 4.4.2.2 Co-condensation Between Phenol and Urea; 4.4.2.3 Addition of Tannins, Lignins and Isocyanates; 4.5 Isocyanate Wood Adhesives; 4.5.1 Chemistry of Isocyanate Wood Adhesives; 4.5.2 Technology of Isocyanate as Adhesives; 4.5.3 Emulsified/emulsifiable Water-dispersed PMDI; 4.5.4 PF/pMDI and UF/pMDI Hybrid Adhesives; 4.5.5 Conditions for Application of Isocyanate Adhesives for Wood; 4.6 Summary; References; 5 Adhesion Theories in Wood Adhesive Bonding | |
505 | 8 | _a5.1 Introduction5.1.1 Wood Material Properties Relevant to Adhesion; 5.1.2 Objectives; 5.2 Mechanical Interlocking and Mechanics of Adhesive-Wood Interactions; 5.2.1 Atomic Force Microscopy (AFM) & Nanoindentation; 5.3 Electrostatic Adhesion; 5.4 Wettability, Surface Energy, Thermodynamic Adhesion; 5.4.1 Wood Anatomy Impact on Wetting; 5.4.2 Extractives; 5.4.3 Adhesive Wettability; 5.4.4 Wood Modification; 5.4.4.1 Acetylation; 5.4.4.2 Grafting; 5.4.4.3 Fire Retardants, Preservatives and Adhesion Promotion; 5.4.5 Test Methods; 5.5 Diffusion Theory of Adhesion; 5.6 Covalent Bonding | |
504 | _aIncludes bibliographical references and index | ||
506 | _aAvailable to OhioLINK libraries | ||
650 | 0 |
_aAdhesives. _0http://id.loc.gov/authorities/subjects/sh85000865 _9134420 |
|
655 | 4 |
_aElectronic books _92032 |
|
700 | 1 |
_aMittal, K. L., _d1945- _0http://id.loc.gov/authorities/names/n79065383 |
|
710 | 2 |
_aOhio Library and Information Network. _0http://id.loc.gov/authorities/names/no95058981 |
|
776 | 0 | 8 |
_iPrint version: _tProgress in adhesion and adhesives _dHoboken, New Jersey : John Wiley and Sons, Inc., [2015] _z9781119162193 _w(DLC) 2015023710 |
856 | 4 | 0 |
_3OhioLINK _zConnect to resource _uhttps://rave.ohiolink.edu/ebooks/ebc2/9781119162346 |
856 | 4 | 0 |
_3Wiley Online Library _zConnect to resource _uhttps://onlinelibrary.wiley.com/doi/book/10.1002/9781119162346 |
856 | 4 | 0 |
_3Wiley Online Library _zConnect to resource (off-campus) _uhttps://go.ohiolink.edu/goto?url=https://onlinelibrary.wiley.com/doi/book/10.1002/9781119162346 |
999 |
_c200463872 _d82084 |