000 | 01146 a2200373 4500 | ||
---|---|---|---|
999 |
_c65482 _d17284 |
||
001 | 65482 | ||
003 | TR-AnTOB | ||
005 | 20200512105927.0 | ||
008 | 071206s2006 nyu 000 0 eng | ||
010 | _a2006922729 | ||
020 | _a9780387279749 (hardback : alk. paper) | ||
020 | _a0387279741 (hardback : alk. paper) | ||
040 |
_aDLC _cDLC |
||
041 | _aeng | ||
042 | _apcc | ||
050 |
_aTK7874 _b.M537 2007 |
||
090 | _aTK7874 .M537 2007 | ||
245 | 1 | 0 |
_aMicro- and opto-electronic materials and structures : _bphysics, mechanics, design, reliability, packaging / _cedited by E. Suhir, Y. C. Lee, C. P. Wong. |
264 | 1 |
_aNew York : _bSpringer, _c2006. |
|
300 |
_av. : _bill. (some col.) ; _c26 cm. |
||
650 |
_aMicroelectronics _92433 |
||
650 |
_aMikroelektronik _913748 |
||
650 |
_aOptoelectronics _93278 |
||
650 |
_aOptoelektronik _913161 |
||
700 |
_aSuhir, Ephraim _937834 |
||
700 |
_aLee, Y. C. _937835 |
||
700 |
_aWong, C. P., _d1947- _937836 |
||
901 | _a0021870 | ||
902 | _abs | ||
906 |
_bibc _corignew _d2 _eepcn _f20 _gy-gencatlg |
||
942 |
_cBK _2lcc |