Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou.

By: Madou, Marc J
Language: İngilizce Publisher: Boca Raton : CRC Press, c2002Edition: 2nd edDescription: 723 p. : col. ill. ; 29 cmISBN: 0849308267Subject(s): Lasers -- Industrial applications | Mikroelektromekanik sistemler -- Tasarım ve yapım | Microelectromechanical systems -- Design and construction | Lazerler -- Endüstriyel uygulamalar | Integrated circuits -- Design and construction | Entegre devreler -- Tasarım ve yapım | Mikroelektronik ambalajlama | Microelectronic packaging | Microelectronics | Mikroelektronik | Machining | MakineleştirmeLOC classification: TK7836 | .M33 2002
Contents:
Ch. 1. Lithography -- Ch. 2. Pattern Transfer with Dry Etching Techniques -- Ch. 3. Pattern Transfer with Additive Techniques -- Ch. 4. Wet Bulk Micromachining -- Ch. 5. Surface Micromachining -- Ch. 6. LIGA and Micromolding -- Ch. 7. A Comparison of Miniaturization Techniques: Top-Down and Bottom-Up Manufacturing -- Ch. 8. Modeling, Brains, Packaging, Sample Preparation, and Substrate Choice -- Ch. 9. Scaling, Actuators, and Power in Miniaturized Systems -- Ch. 10. Miniaturization Applications -- App. A. Metrology Techniques for MEMS -- App. B. Living Book -- App. C. Si and SiO[subscript 2] Etch Rates in KOH -- App. D. Genetics -- App. F. MEMS Companies.
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Ayrılmış ders kitapları TK7836 .M33 2002 (Browse shelf) 1 1 Available 0028335

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Includes bibliographical references and index.

Ch. 1. Lithography -- Ch. 2. Pattern Transfer with Dry Etching Techniques -- Ch. 3. Pattern Transfer with Additive Techniques -- Ch. 4. Wet Bulk Micromachining -- Ch. 5. Surface Micromachining -- Ch. 6. LIGA and Micromolding -- Ch. 7. A Comparison of Miniaturization Techniques: Top-Down and Bottom-Up Manufacturing -- Ch. 8. Modeling, Brains, Packaging, Sample Preparation, and Substrate Choice -- Ch. 9. Scaling, Actuators, and Power in Miniaturized Systems -- Ch. 10. Miniaturization Applications -- App. A. Metrology Techniques for MEMS -- App. B. Living Book -- App. C. Si and SiO[subscript 2] Etch Rates in KOH -- App. D. Genetics -- App. F. MEMS Companies.

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